Construction Started! Groundbreaking Ceremony for Bronze Wide-Band Gap Semiconductor Industry Base

In the morning of January 18, the groundbreaking ceremony for the Bronze Wide-band Gap Semiconductor Industry Base was held in Pingshan, Shenzhen, marking the beginning of a new stage of Bronze Technologies Group.

Located southwest to the intersection of Danzi Avenue and Guangke 3rd Road in Pingshan District, the Bronze Wide-Band Gap Semiconductor Industry Base occupies an area of 8073.79 square meters and a total construction area of nearly 50,000 square meters. It is a key project in Shenzhen in 2020 and is expected to be completed by the end of 2022. The base will serve as the headquarters of Bronze Technologies Group, and will be equipped with a Wide-band Gap semiconductor R&D center, automotive-grade SiC power device packaging lines, and an EU-China innovation center incubator. It is expected to develop into a leading Wide-band Gap semiconductor industry base in China with R&D and manufacturing capabilities across the entire industrial chain.